Memory
This week, Kioxia introduced its new 3D QLC NAND devices aimed at high-performance, high-capacity drives that could redefine what we typically expect from QLC-based SSDs. The components are 1 Tb and 2 Tb 3D QLC NAND ICs with a 3600 MT/s interface speed that could enable M.2-2230 SSDs with a 4 TB capacity and decent performance. Kioxia's 1 Tb (128 MB) and 2 Tb (256 TB) 3D QLC NAND devices are made on the company's BICS 8 process technology and feature 238 active layers as well as CMOS directly Bonded to Array (CBA) design, which implies that CMOS (including interface and buffers circuitry) is built on a specialized node and bonded to the memory array. Such a manufacturing process enabled Kioxia (and its manufacturing partner...
Kingston Reveals DDR4-2933 Registered DIMMs for Cascade Lake-SP
Coinciding with the launch of Intel’s Xeon ‘Cascade Lake-SP’ platform, Kingston on Tuesday announced its new Server Premier registered DIMMs designed for the latest servers. The modules offer data...
1 by Anton Shilov on 4/2/2019
Samsung Develops Smaller DDR4 Dies Using 3rd Gen 10nm-Class Process Tech
Samsung has completed development of its 3rd-generation 10 nm-class manufacturing process for DRAM as well as the first 8 Gb DDR4 chip that uses the technology. The 1z-nm process...
28 by Anton Shilov on 3/21/2019
Samsung HBM2E ‘Flashbolt’ Memory for GPUs: 16 GB Per Stack, 3.2 Gbps
Samsung has introduced the industry’s first memory that correspond to the HBM2E specification. The company’s new Flashbolt memory stacks increase performance by 33% and offer double per-die as well...
25 by Anton Shilov on 3/20/2019
Samsung Begins Mass Production of 12 GB LPDDR4X for Smartphones
Samsung said late on Wednesday that it had started volume production of 12 GB LPDDR4X-4266 memory for high-end smartphones. The chip is the highest-density DRAM for mobile applications. The...
19 by Anton Shilov on 3/14/2019
SK Hynix Details DDR5-6400
SK Hynix this week revealed some additional technical details about its upcoming DDR5-6400 memory chip at the International Solid State Circuits Conference. The die size of the company’s 16...
10 by Anton Shilov on 2/26/2019
Advantech Unveils 32 GB SQRAM DDR4 DIMMs for HPC
Advantech, a maker of server-grade memory, storage, and other components and solutions, is introducing a new lineup of 32 GB unbuffered DDR4 memory modules. Designed for high-performance computing (HPC...
7 by Anton Shilov on 2/13/2019
Corsair 192 GB DDR4 kits for W-3175X Listed Online: Up to $3000
Corsair has released a range of 192 GB DDR4 kits to complement the workstation-focused Intel Xeon W-3175X processor which features 28 cores. The top kit from the new line-up...
9 by Gavin Bonshor on 2/12/2019
Keysight Reveals DDR5 Testing & Validation System
Keysight, an electronic measurement company, has introduced the industry’s first off-the-shelf testing and validation system for DDR5 DRAM. The N6475A DDR5 Tx compliance test software is aimed at developers...
23 by Anton Shilov on 2/6/2019
G.Skill Unveils Trident Z Royal Hexa-Channel 192 GB DDR4-4000 Kit for Xeon W-3175X
G.Skill has released the industry’s first hexa-channel DDR4 memory kits designed specifically for Intel’s 28-core Xeon W-3175X processor for extreme workstations. The top-of-the-range kit features a 192 GB capacity...
15 by Anton Shilov on 1/30/2019
GIGABYTE Adds Support for 128 GB of Memory to Z390 & C246 Motherboards
GIGABYTE has released UEFI BIOS updates for its motherboards based on Intel’s C246 and Z390 chipsets that enable support for 32 GB unbuffered memory modules from Samsung. This enables...
28 by Anton Shilov on 1/24/2019
Double Height DDR4: 32GB Modules from G.Skill and ZADAK Reviewed
Two memory module companies, G.Skill and ZADAK, have developed a new memory format with double capacity DDR4 memory. These new modules put the equivalent of two standard modules onto...
52 by Ian Cutress & Gavin Bonshor on 1/23/2019
ASUS Z390 Platforms Now Support 128 GB of Memory
ASUS has released a new UEFI BIOS version for its ROG Maximus XI Hero motherboard that enables support of up to 128 GB of DDR4 memory platform using 32...
8 by Anton Shilov on 1/22/2019
CES 2019: GIGABYTE Aorus RGB Memory Hits DDR4-4000 with SK Hynix ICs
GIGABYTE last year entered the memory market with its Aorus RGB and GIGABYTE-branded DIMMs, designed for enthusiasts. To some degree the project was experimental with conservative DDR4-2666 and DDR4-3200...
3 by Anton Shilov on 1/14/2019
CES 2019: ADATA Spectrix Memory & SSDs Get More RGB
RGB lighting has become a major selling point for hardware aimed at gamers and performance enthusiasts. After all, since modern CPUs, GPUs, DRAMs, SSDs, and other components offer plenty...
4 by Anton Shilov on 1/14/2019
CES 2019: TeamGroup And ASRock Release Phantom Gaming Branded Memory and SSD
One of the leading players in memory Team Group has joined forces with ASRock to release the Phantom Gaming branded T-FORCE DELTA Phantom Gaming RGB SSD and T-FORCE XCALIBUR...
5 by Gavin Bonshor on 1/10/2019
CES 2019: Thermaltake Unveils Its WaterRAM RGB Liquid Cooled DDR4-3200 Memory
At CES 2019 Thermaltake officially entered the memory market with two new kits of DDR4 3200 RAM which not only include integrated water blocks but also includes 16.8 million...
13 by Gavin Bonshor on 1/9/2019
JEDEC Updates HBM Spec to Boost Capacity & Performance: 24 GB, 307 GB/s Per Stack
JEDEC this week published an updated version of its JESD235 specification, which describes HBM and HBM2 DRAM. The new version of the standard allows memory manufacturers to increase capacities...
15 by Anton Shilov on 12/19/2018
Intel's Architecture Day 2018: The Future of Core, Intel GPUs, 10nm, and Hybrid x86
It has been hard to miss the fact that Intel has been vacuuming up a lot of industry talent, which brings with them a lot of experience. Renduchintala, Koduri...
149 by Dr. Ian Cutress on 12/12/2018
Apacer Launches 32-Bit SODIMM for Arm & RISC-V Systems
Apacer has announced a lineup of 32-bit SO-DIMMs designed for systems based on processors featuring Arm, RISC, or RISC-V architectures. The memory modules will enable SoC developers to take...
5 by Anton Shilov on 11/26/2018
Cadence Tapes Out GDDR6 IP on Samsung 7LPP Using EUV
Cadence has announced that it has successfully taped out its GDDR6 IP on Samsung’s 7LPP fabrication process. The new building blocks should enable developers of various chips to be...
11 by Anton Shilov on 11/26/2018
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